Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
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